Uneven CPU thermals!

Didn’t know that, that’s why I’m surprised :slight_smile:

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Apologies for coming off snarky

It’s more a frustration and disappointment with Framework that I feel when they continue these kinds of business practices.

Maybe I’m wrong or missing context, but it sounds like they are shipping new heatsinks, and the only change is from liquid metal to PTM thermal compound. They were vocal about this change and were shipping people PTM sheets for anyone wanting to switch to that from the liquid metal. But in either case, it’s the same heatsink. That was my understanding.

There are improvements to be had by peeling off the stock spacer/shim and replacing it, but I didn’t do that. I just switched from liquid metal to PTM and I can hit the specified wattage on the CPU.

Has Framework said the actual heatsink is changing or has changed? I’m only aware of the change from liquid metal between the heatsink and CPU die, to PTM phase change stuff.

Apparently they are new “new” heatsinks for 7040HS (I quoted the rep above) but they aren’t shipping them yet because they want to get rid of the old stock.

So they are shipping liquid metal with poorly soldered shim AND Type C PTM. The newer ones with no/better shim, no liquid metal and PTM are available but are not yet being shipped.

Holy crap!! It’s almost like I bought a new laptop!!!
The difference is night and day.

So the upgrades:

  1. Remove LM and replace with PTM (Type C) while removing old shim, soldering and polishing new shim to a mirror shine.
  2. For 7700S replace to gen 2 fans, gen 2 enclosure, convert from paste to PTM (Type D).

Interestingly a blemish IN the CPU die cover. Not sure whether LM diffused into it or it came like this but it’s inside the glass (the glass otherwise is pristine).

And finally the results (stock firmware)!
I’m unable to drive CPU above 88C (s-tui) and I-GPU above 73C (hashcat) and D-GPU above 60C (hashcat). Under the combined full load the CPU sustains almost 4GHz with full load on the 780M as well!

And to think I couldn’t drive package power above 35W due to thermal throttling before!
Pre-upgrade data: Uneven CPU thermals! - #1559 by Arcadiy_Ivanov1

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Am I reading correctly that it’s pulling close to 110W?

He’s also loading the iGPU up, so that kind of power draw would make sense.

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Correct. Hashcat is banging at an unsolvable problem on both i- and d-GPUs, plus s-tui stress-testing the CPU.

Also an important note (@Eagle might be interested): on the old heatsink the thermal pads became brittle! When I was inspecting the old one the thermal pads were not soft spongy at all and when I picked at them with a fingernail they cracked (not tore) and came off in chunks. It’s only been 2 - 2.5 years of continuous (nearly 24/7) use.

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Yup, mine basically shattered when I replaced my heatsink, so I use thermal putty now.

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I’ll share internally.

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What actual solder and such did you use to do the modification? The soldered shim I got set up seems to not be providing anything nearly that good, so I clearly messed up somehow, but I’m not sure what said mess-up was. Removing the old shim was the biggest problem for me too, it was REALLY stuck on there. Do you know how much the vapor chamber can take in the way of high temperatures, on that note? 'Cause that might have been what really messed up my attempt.

Chip Quik SMDLTLFP Solder Paste Sn42/Bi57.6/Ag0.4 No-Clean Lead-Free Low Temperature Melts 138C 281F

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Have you tried any benchmarks to see if performance improved?

I think I posted the metrics. 35W (3.4GHz) → 45W (3.8Ghz) on all cores sustained. Drawing 110W with iGPU on (before that it caused CPU clock to drop to 1GHz or lower due to thermals).

I also finally see single core pushing to >5GHz in s-tui, i.e. the CPU now performs to its full advertised limits and is not constrained by the thermals.

I was thinking more in terms of e.g. Geekbench or similar.

No sorry - ain’t nobody got time for dat!

You redid, what is beeing done here before. You get the same Results with the PTM Sandwich Shim. As i said before, its not worth the effort. Mine is also soldered and i still get the same results as anyone with a Sandwich. You only get alot more out of the System with opening the uefi locks. I can get about 60w sustained, but the gain is below 5% in Comparison to the 20% more Power used. The 7X40HS isnt scaling great with extra Power. The only real benefit from this mod either soldering or PTM is quieter operation in day to day use.

directly after soldering my shim i did some testing days with liquid metal. I could get above 80w peak from the cpu alone (and no i do not consider using the igpu) and sustained 65w. But having LM Risk in a Mobile Device wasnt worth the gain for me. PTM is my GoTo.

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That’s a bizarre comment. I never claimed I did something unique, I literally asked for what people did and then reproduced it. I did do the oven preheat to +100C successfully after calibrating the oven, but that’s about it.

Just wanted to chime in and confirm the compatibility of the Ryzen AI 300 heatsink, since I didn’t see any other reports when I skimmed this thread. I have a Batch 1 FW16, and aside from moving some of the thermal pads around and reusing a couple of the old ones, it all worked great. My laptop is doing much better than before now, and was definitely the move for me (just didn’t have the time/energy to do all the operations for the sandwich).

Here are the old and new heatsinks before any modifications.

Some of the shielding had to be cut away to make room for the old pads, and I placed the pad in those spots to help make the cuts.

Then I placed the pads on the components directly to double check that they had appropriate thickness and good placement, then dropped the heatsink on top of it all. I did cut some of the thermal pads both to make them thinner and smaller. It’d probably be best to buy a set of pads but I needed my laptop working again quickly. I ensured all the original pads were accounted for from the original heatsink before adding pads in some of the new heatsink locations.

Since then everything’s been much better. 70-75C under my normal video game loads as opposed to throttling and basically silent while idling in windows. I have some things to optimize on the linux side but it’s already much better there as well.

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