I have a question about the durability of the modular ports on the Framework 13.
I have a metal USB stick which requires a bit of extra force to remove from a USB-A port. This has resulted in the modular bay that houses the USB-A module to become a bit loose. As of right now, any module inserted into that bay sags a tiny bit. I am concerned about the long-term mechanical robustness of these modular ports. I have changed how I remove the usb stick in the mean time so no more damage should occur.
Would there be any way to remedy this in the future without replacing the chassis?
I’m presuming you’re concerned about the ports on the motherboard, that the expansion card modules plug into?
They are pretty well protected just by the nature of the expansion cards. The guide rails restrain the forces the ports can easily be subjected to.
A normal outside port can have something plugged into it pull sideways or up/down, exert leveraging force, and also see twisting forces. But the expansion cards, via the guide rails, can’t do that very much at all. So while damage is still possible it should be much less likely.
And they carry the same durability ratings as is common for USB-C ports.