[GUIDE] Liquid metal removal & PTM usage

[Alex_Uta]

@CPUMiner I had a look at the steps from “Prerequisite 1/2 and Guide - Preparations” and I’m a bit shocked , sorry.

I’d be scared to try all that even if I already replaced my mainboard with a new one.

I removed the liquid metal a while back when that thread was started and, the steps from this Guide would make me say “Nope, there’s no way I’ll mess with this”.

A while back @taezea shared some really good tips about how to make it easier.

Uneven CPU thermals!

I was away for a holiday, so I was catching up on this thread, seeing very interesting comments and results. I have replaced the LM with some thermal pas I had laying around, and I have 16k+ results again in CB r23, results I had only seen the initial runs just when I got the replacement board. I made some pictures of when I removed the LM. [IMG_2141] [IMG_2142] [IMG_2143] [IMG_2144] I used a bit of brainpower, I ran the machine hot with CB R23 and flipped it and let it cool down so I co…

More exactly, this part:

@taezea

I used a bit of brainpower, I ran the machine hot with CB R23 and flipped it and let it cool down so I could easily remove it, and that worked. Could be a useful tip for anyone looking to remove the heat-sink and do some servicing on it.

Most of the LM ran to the sides and a little layer was left touching around 50 % of the die.
You can see the peel I got in the pictures.
I think Framework is not using enough lm to account for the out flow to the sides once it liquefies.
This would explain initial results doing great, but once the LM runs thin and “leaks” to the sides you get worse thermals and or performance.

Removing the button, starting the laptop with the heatsink slightly removed and everything else would in fact increase the risk of damaging the mainboard.