Yeah, do some 3D Models, because what you are talking about is not comprehensible.
I watched the video from Linus, but i don’t get, how you would do that without damage the bottom-case. You would have to cut out a big hole like on linus video. So yeah, better draw a 3D Model.
This suppose to be a laptop
Here is looking from below, left is with the cover and right is withoud, exposing the cpu heatsink with the flat top and the 4 screw holes to “add more”(not replace) cooling
Here is a small 10mm height cooling mod
and here one that uses the exhaust no needing fan
These are just on-the-fly ideas, everything needs to be tested to see what is the benefit, is there is some, but once you have the option it is easier
Ahh, i see. I just checked the “The Verge” video about 16" Laptop. It will not work, because the CPU points upwards (to the keyboard). The existing heatsink is therefore also mounted pointing upwards.
It’s impossible with that idea. So it will not work.
Look here: Framework 16: an exclusive look inside the modular gaming laptop - YouTube
And there is also not a lot room for more cooling. Maybe someone else has a freaking good idea. But i don’t see any idea, when you wan’t to bee still mobile (like a laptop).
And these laptop-coolers like you linked above (the one for the steamdeck) are super bad. On amazon there are sooo many comments about not deacreasing a single °C. And they are loud like a airplane.
Also these laptop-pads, where you put your laptop on are often completly useless. It is only usefull, if you have a lot of holes in the bottom-case of the laptop. Otherwise it will just blow air on the case, which is completly useless.
And i heard it will have liquid metal attached. So you can’t also not increase it by using liquid metal.
So if someone has an idea, im also interested. Because cooling is also the weakspot of such laptops.
Here is a better Picture of the cooler :https://static.frame.work/i9cek06kyewaol50nyuu41p7938t
you can see there the fins and the end of the heatpipes.
So what you cant do:
There is no space on the upper side of the heatpipe. So you cant just “attach” a heatsink on the upper side, beacuse there is the case of thr laptop.
Replace the heatsink. That is illusional. First of all there is not more space, so using another heatsink makes no sense. Second there is not more space for more or bigger heatpipes.
What you theoretically could do:
BUT: It’s hard to see on the “The Verge” video, bit as far as i can see it, there is maybe ~1mm space above the existing heatsink. So there is actually no space free. So this is sadly not possible i think.
Second possibility: remove the existing fins (huge risk of damaging the heatpipes) and attach bigger one (same size but mor height). This is a) very difficult and b) you would not be able to use it as a normal laptop anymore, because you would have to cut holes in the laptop and the fins would come out of thr laptop.
third possibility: You could take off the fins and mount flat heatpipes at the bottomside of the existing heatpipes (and then reattache the fins or bigger fins at the bottomside). The new heatpipes comes out (somewhere) on the backside of the laptop an there you could mount a second heatsink + fan. This would also lead in no portability anymore. Also very difficult to do.
If there would be enough space to mount on flat heatpipes with graphit thermal pad and (somehow) with magnets, it could be still transportable somehow. But as i said i see no space and copper is not magnetic.
General Problem: The hinge of the screen sits right behind the fins. So “guiding” out some heatpipes would mean, you have to bypass these hinge, because they are in the way.
So im out of ideas atm. If someone has an idea, i would like to hear.
The only other thing which could really be possible (but helps maybe only a bit):
But as i said: This would make this metal cover heat up a lot and im not sure if that could damage the keyboard. And it would make it a bit more difficult to open up the laptop. So you would have to take not so much “sticky” thermal pads.
I dont knoe how much mm there is between the pipes and the top-cover. If it is more than only ~ half a millimeter, maybe you could use copper, which you glue on the heatpipes and then using thinner thermalpads like these graphit-ones from thermal crizzly i believe. But im not sure if the pressure would be high enough or if it would just bend the top-cover up.
So connect the heatpipe with the metal-case where it is possible and where it does not heat up other electronics.
Edit: I have another idea (i write a third post because the other is long enough): But i have no idea, how good it is:
Ok, look, there are these little bars left and right from the keyboard and left and right from the touchpad (they are moveable too).
You could take them off temporary (if laptop is in desktop-usage). As i said above: Connect the heatpipes with thermalpads with the metal-cover which sits on top of the hardware. But try to (somehow) connect the heatpipes with the metal-cover, which is directly on the spots, where these bars are.
Then you could add some magnets somewhere below the metal-cover (just somewhere, where there is free space to glue magnets on the metal cover). So now, when the laptop is build together, you could take these bars off and put a heatsink on the place, where the bars were.
My Idea is now: Buy any heatsink, which fits good from the dimensions. Drill some hole in the heatsink and glue some magnets in it (at the same spots, where the other magnets sits, which are mounted below the metal-cover).
Now buy some of these reusable graphit-thermal pads from thermalgrizzly. Then put it on the free space, were the bars were and put the heatsinks on top of it and hope, that the magnets make enough “mounting pressure”, to connect the heatsink with the metal-cover. And hope, that this little metal-sheet does not bend, otherwise this graphit-thermalpad maybe has no good contact.
If wanted: At some fans. If you have to go just take off the heatsink (because there are only magnets) and the graphit-pad (its reusable).
So for now: This is my beast idea. But it is an idea. Maybe this is a total fail. But in my opinion this is the best “give a try” which lets the laptop be a laptop and untouched (no drilling holes in laptop and only parts, which you can take of in a second).
Edit2: I heard of a thermalpad, which have mindblowing heat conductive capabilities, BUT only in the x and y axis (so it does only spread heat. A normal thermal pad should guide the heat on the z-axis.). In this case this could be very helpfull to spread the heat over the whole area, where these bars sits. Because the hestpipes are only ~ 1cm wide or so.
So maybe you could do this: Attach thermal pad on top of the heatpipes. But they now dont have to touch the metal-cover. Put some of these special-thermal pads between. But they are very thin, so you would have to glue them with thermal-glue on the metal-cover. Then it sits between the thermal pad and the metal-cover. Maybe it spreads the heat a bit, maybe the thermal-glue destroys the effect.
So hope it spreads the heat better.
I mean this “special” pads (he is applying wrong because he thinks it has high z-axis heat transfer. Read also the comment from jpeg6 in this video):
Edit 3: For sure, you have these bars left and right from the keyboard only, if you are not using the 10-key from the keyboad. Otherwise there is no bar.
Edit 4: Instead of using thermal pads, you could use thermal putty. Watch this for this topic: https://youtu.be/raHKGnJ4LYM?t=547
The contact surface for expanding the cooling doesn’t need to be over the cpu, that will be i think the best option, but the heat pipe is very good at conducting heat, so the contact surface could be at any point. (i put it on opposite side of the cpu for my steamdeck, it works very well, but i can imagine heat pipe has a limited capacity of transferring heat, but at the same time, a bigger dissipation surface will do more than the small one that most of the laptops have)
The reason why i am saying this must be done by the manufacturer is that it must be in the design, so i don’t need to do some ugly cutting or destroy something while trying. The experience must be, buying or DIYing something, take out a cover, align the holes and screwing it, and end. Well attached and secure.
So at some point of the heat pipe, a 3x3, 2x3, 1x3… expansion surface is an easy solution, if not possible, make the heat pipe longer, so it gets to somewhere where its space to attach the expansion cooling, or more extreme, having a dedicated heat pipe for it. There could be also a portion of the fins that are detachable, unscrew it and attach more cooling, sort of what you suggested but with the device ready for this option, no need to make your device ugly or destroy it in the process
If the case is not from a good heat conductive material, there is no case to making it uncomfortable but is also an idea, i made that with my macbook, but in this case, the case is aluminum and i help it by putting the macbook over a huge heatsink i have, otherwise i didn’t soo any benefit. Also, there is a steamdeck case that use the same idea, i find it very inefficient, but that is why it must be done by the manufacturer, again, so that it won’t be nearly useless. If the steamdeck heatsink already has the surface i am suggesting, the case could have a detachable cover to quick attach more cooling directly and more efficiently. The steamdeck air forcer is another not so good idea because it only tries to force more air throw the same surface, there is not to much to de there, and is an old idea that came from the laptop era, that wasn’t already there a very good idea to.
The idea of quick detachable cooling sounds nice, but i can’t think on an efficient way of having good contact, maintaining it clean and avoiding damaging the pads or making a mess with the paste. These dry thermal pads are too fragile, a normal thermal pad seems less trouble, but you will need some kind of cover to avoid damaging it or dirt while is not on, and thermal paste is the same but more messy.
I like something more permanent, that stays as a part of the device and allows you to have the benefit all the time maintaining sort of the compact shape
I am not fully convinced about the quick detachable solutions, i will want the cooling performance to stay with me, not at home, and something that adds 1 or 2cm to the device is acceptable for me
Did you even read my posts 
?
I mean i did clearly analyse, where, where not and how you could route the heatpipes and so on. There is pretty sure no space to route heatpipes. And you are just saying the same like you would never read, what people are writing here.
Did you even watch the videos i linked?
For me it seems you just have this idea in your mind, but you have absolutley no clue how to do it.
As i said, the CPU is pointing upwards. So you can’t go out on the bottomside of the laptop.
So make a real design of a real idea instead of having basic ideas.
As i said, make a design. Others will not design it for you and for sure framework does it not either. Framework will not completly redesign their cooling-design because of your wishes and wants. You have to design it.
Yeah, if easy, then design it Then you can make the heatpipes going “somewhere” xD
Stop wishing and thinking. Do it. But please watch the “the verge” video and search for real footage to make sure, it actually will work.
So then design, what you want/need. We are exited to see, what you will design.
For sure we don’t do it for you. And for sure framework will certainly not do for you what you are too lazy to do or unable to do.
We gave you some points. Now do sth with it.
We are exited to see, what you are designing (at least i am exited to see, what real designs you will do, because im also interested in cooling-mods).
Platos, if I understand both of your passionate posts here I think you’re missing that pani alex is suggesting routing everything =outside= the case. He just is looking for a way to attach around the cpu and an access panel on the back cover to pass thru.
I do agree that you’re not likely to get FW to assist with something that is =very= niche – you’ll need to find attachment methods on your own and then get out the dremel tool for the opening.
Im even not sure anymore, which model he actually meant. I thought he means the 16" laptop, but i missunderstood that probably (if he means the 13" it shows even more, that he was never reading my posts, because i was clearly reffering to the 16" model in all videos i have linked and all my ideas were clearly reffering to it too).
But as i said, i see no way to bring the heat from the cpu outside of the case to this attachment. And as i also said the CPU is pointing upwards (on both, 13" and 16" Laptop).
Anyway: I think he has just very rudimentary “ideas” and is hoping, others will tell him, how to do. But i am not really sure, if he has any interest in really doing sth for it. Because as it seems, he does not even read the posts of us exactly. Because he just repeats his basic-idea over and over again. He does not bring some specifics idea, where to route the heat out, nor does he have informed himself about the laptop, because he had not even an idea, that the cpu is not pointing downwards.
That’s not not make me feel wanting to help him, because for me it seems he just throws in his basic-concept and then let others do it for him.
And if he meant the 13" model: I would say this model is even more complicated to mod in that topic. There is even less space, so at least it seems so on pictures/videos (i dont have one atm).
So i meam if he would really!!! bring some REAL ideas, which would actually be compatible to his device and not only be a mind-map like idea, then i would maybe have interests in helping or adding my ideas.
But as long he is just throwing in his basic-ideas which has no actual compatibility to the device, im sure most other users have no interest in helping him.
He want’s to find a way to bring out the heat out of the case to attach “it” (a heatpipe or so) to a cooler. So at least that was, what he showed us in his pictures.
And i tried to analyse where you could route the heat through, but i saw no (efficient) way to do (except the solutions i said).
But he has clearly showed, he has no interest in designing ANYTHING himself. He want, that others do it for him. He has only his basic idea and does not even inform himself and looking, if his ideas are compatible with the device.
So he shall design something. I mean a real design which is compatible to the device. And then he can ask for help or tips. But not like that way he is doing. Just trying to let others do it for him.
Platos, i think we are not understanding each other. The point of my post was to give and idea to the framework team, not to build a product for me, nor me to design a working product, just to sheare an idea for the team to think about it.
I want to point out that i am not an engineer and don’t went to the uni, so i dont know so many terminologies, but i like to diy and have done work in plumbing, electricity, ultra basic electronic, engine mechanic, wood and work in programing, just basic in most of them, but once you know how things work, its easyer to get ideas about how things look like.
Having said that, i said earlier that there is no need for the “contract surface for the cooling expansion” to be at the beginning of the heat pipe or over the cpu, so it doesn’t mether where is the cpu located, and the contact could be anywhere where enough space for a contact surface is. So yes i watched the video, and saw that the cpu is under the keyboard, but having a heat pipe carrying the heat to the edge, where is possible to put a contact surface , like others and i have done with my steam deck
In resume, what i am asking is for the manufacturers of the devices is to attach somewhere on the heat pipe a surface, so that it will be easyer to add more cooling and what is even more important, it will be more efficient, because the surface will be uniform and welded to the heat pipe, not somehow attached, hoping that the thermal paste or pad will do a good job,… and adding a cover to access it. Having that as an option, the companies like jsaux will be able to make cooling devices that are not a joke and have real and efficient results
Also, i can not design something that demands changes in a device, that must to be done by the engineers that are working in the device, i give the idea, and they decide if and how to make it, but if it will not be something decent and instead something like jsuax, i will say, don’t even bother.
Platos, i am giving an “idea”, for “devices” i am not designing and demanding changes on them, i don’t own then and i don’t work for them, also what i am wanting from framework is to offer the contact surface, not the external cooling device, what i show is just to have an idea of what could be possible, the external cooling devices will be done by 3er party companies dedicated on that or for people that like to diy
read the title, ïdea". you are making me angry, puting words in my mouth and making me seeing like a lazy person, “i just wanted to give an idea” That doesn’t mean that i have to design a working prototype for devices that i don’t even have influence to change them
Ok, if you are not willing to design/do anything by yourself, then i have to say you, it will never happen.
You thought framework could implement that. That’s fine.
But they will not. You would really have to do it by yourself and also design sth by yourself.
i don’t know what is your job in life and why are you so aggressive, i just wanted to share an idea, but looks like in your word it’s not allowed, sounds like the dictator? i believe the point of a forum is to post questions, ideas, share, have a conversation, so if i don’t say what i think, how am i gonna know others think about that, or how am i gonna make others know on something that could or not be a good idea?
i was hopping them to think aboud, most of the people already use dayli some king of extra cooling device
Pani, don’t ever be afraid to chat about ideas here — it’s absolutely a great part of the community! There really aren’t any “bad” ideas – some will make more sense than others and that’s OK. In this case what you’re suggesting is definitely going to fall into the category of too-few-people-that-want-it / too-few-people-to work-on-it for Framework to take an active look at it – so it will definitely be something that you need to look at yourself and, if interesting to others, collaborate. And it looks like you’ve stumbled on someone that is interested enough in the idea to put some thought into it, but weirdly interested in putting in a lot of energy to try to convince you that it’s a “bad” idea. Because people are people you’ll get some that mention the technical challenges (or hard roadblocks like is the case here) and move on, and others that stick around and get frustrated by the conversation and want to talk about that more than the technical issue.
I think we’re into that now so I’m probably going to stop watching this one. Good luck!
Ok, apologize for my rude words. I just think, it’s a bit rude too to just think all others will do it for you, but you are not willing to invest some work for real designs (at least it seems like that).
But to the topic: These kind of laptop-coolers you’ve postet are often really 100% useless. Yes, a lot of them uses them, but as i said, they are often absolutley 100% useless and people think it helps, but it dont. You can read hundreds over hundrets recessions (on amazon for examplr) of bad reviews which says, it doesnt work at all.
Sometimes it can work, but it depends highly on the laptop-design (if there are open holes on the exact right place and how big and so on). And this “air-sucker” are so loud, it is a joke. You could also just set laptop-fans to 100%. Would be better probably.
But again: Yeah, better cooling would be nice, but as i said: Both, the 13" and 16" laptops have their CPU pointing upwards. So your pictures from above will not work. And the 13" has no swappable parts (keyboard). The whole top-cover is the keyboard. And there is always not really much space in height for using heatpipes. For Example the CEO wrote somewhere, there is only a fraction of a mm over the SSD (in the 16" model), so no cooler are possible (you could only use Thermalpads to connect it to the upper surface). So you will not have space for 1-3mm thick heatpipes to route through the whole laptop. Impossible. So you cant go to the backside, you cant route with heatpipes and other possibilities i wrote some posts ago. So YOU would really have to have a very clever idea.
So you need really to think more about. Even if you only want to “make them think about” (and not doing it by yourself). If you bring no ideas, they will not even think a second about it. If you bring a really easy possibility to implement that, maaaaaaybe they think about (but that does not mean, they implement it).
So as long you do not design sth, it will not become true. That’s very sure.
already explained that, i can’t do it, i am not the one to say “change this”, neither i have one to see and measure how, just pictures of it.
Let me try to explane it in a way you may get it and stop the nonsense when you want a house, do you have to make the plans? or just “tell” someone your idea…, or or, if you have some suggestions for someone, do you have to make it work first?.. when 2 or more people that have sort of the same job talk about how something can be done, does the one that makes the suggestion have to first solve the problem, test it in a real environment and then, just then, have he the right to talk about it? when you go to the mechanic, do you have to tell him exactly what and how to do, the parts he have to change and all the litle things in between? or you just say, i hear a click click… i can go on the whole day, way? because its life, if no one says something, nothing will evolve, move, advance, get better. How does things get better, someone make something, then someone else says, why dont you make this ot that, and with each iteration things gets better.
Also already explained why it doesn’t mether where is the source of heat, the same why it doesn’t matter with the actual product. So if you do not get it or are not able to imagine it, it’s not on me to teach you how things work or why with the actual or a new heat pipe is not too much of a problem, so stop pushing the ‘you are lazy’ the same way can i say go educate yourself and come back when you understand what i am talking about
i feel like i will have to make a video or meet you in person to explain it all, from the beginning of time til now and the future, and show i live the things i already explained, or just ignore you since i dont know anymore if you are making fun of me
I don’t believe @pani_alex expects anything to be given away for free.
I think they intend to pay for it.
Let’s keep replies helpful and add to the conversation. Please don’t read into others’ intentions - have a well-informed debate about the matter at hand and don’t attack the person.
This thread is on very thin ice.
To be clear is not like li want them to build something just for me, i like if the idea is good enough that something like this will be a standard, like changing ram, ssd, ports.
Just throw an idea for the team, which i am not part of and therefore can not develop something for the product, and also if i theoretically develop something for a product is because i will be paid for, because i work in the company or because the hired me for that, not for free. I wish i have a job in some research prototyping tech team.
obviously i will buy something i like, but if you mean i will financiate the develop of a product for them to build just one for me?, no, i am not a millionaire, don’t have that much money to waste, and i think they also don’t expect to profit only once from a product, but if i was, i will make my own company, make the product and profit from it, like it
I can’t understand what is the motivation in this forum (i was expecting more a way of thinking of let’s change the word, not let’s find someone to mess with, defame and beat him to death just for fun or because I’m bored) for to take the word idea i said and change it with i demand you to do this for free for me mf, so for the million time, this thread is just an idea, a suggestion for the team to think about, if is good enough to make another feature on their product, if they do not like it, they won’t take it.
But i thought it was worth mentioning it in case no one has had this idea jet, and also it looks like framework is a company more oriented on giving value, not just on giving the minimum possible so that they can say, the product works so pay it and shut up,… so i thought, welding a peace of copper on the head pipe can’t be that expensive to add on the manufacturing side, and or if they think just the copper and all the rest is on you, like cutting the case or on 3er party companies to make new cases and so, and the extra cooling i was thinking in 3ar parties but when a company is big enough seen like they also like to make everything. This king of detailed conversations are made normally in a team or teams (wich i am not part of), in a meeting (wich i have no access) where a group of person asks and discuss how, the pro and contras and sure many more things that only they know
To the moderator, feel free to delete the post since looks to be no interest for the group of persons wanted, just for the bullies and making the world a worse place which is not my objective
Still thinking about it 
it occurs to me that the 16 has an easy access for adding more p&p hot-plug cooling, if you dont use the numeric pad, the heat pipes are just below the side covers, and if they make one that can be quickly detached alone, a hole in the shield that exposes the pipes, and a copper plate with hooks or magnets to quick attach cooling, its done.
That is also true for the gpu, the pipes are well on the outside where nothing could get in the way and don’t need an unreasonable effort more than adding a detachable cover and a contact surface to.
More crazier will be if those contact surfaces are on the bottom (just because now all the pipes are facing up) so that if there is a cooling base, you can just take out 4 covers and just place it over.
Allowing not only the possibility to add some more heatsinks but also wc, and just like that easy being able to unleash the beast
Aplicable to mini pcs to
Now that the concept of the gigantic desktop is slowly disappearing, going back to the old times of the wc outside of the pc, to make it quieter or allow the use of the full potential without pushing the thermos to the limit (the wc can also be embedded in the desktop, but that since like a project for ltt)
It occurred to me while i was thinking how can i quickly add more cooling to my cpu and gpu (because it is so loud) without losing the air cooling and the easiest way is just to solder a pipe to the heat pipes where the water can flow, adding extra heat extraction to the actual heatsink. That is another cheap enough idea for cooler manufacturers, for adding some extra pipes to the coolers where you can hook hoses or a surface for a water block, having a hybrid cooling system that is able to be quiet on load (my pc sounds always like a plane taking of because a don’t want it to reach 70C). That could allow to pack gpus in a more compact format, but i still think that gpus should come with a vapor chamber that unifies all the heat sources (gpu, vram, vrms), so that you choose the cooling, like with cpus.
But making hybrid coolers a standard or at least more common will be nice too.
A second slim quick detachable tower sounds nice for the people who need a powerful pc on the go or the ones that go to LAN parties, and the ones that just like it quiet or extreme or oc
