Last night in the #framework-discussion channel on Discord, we discussed the dimensions and whether the CM5 module would fit within the Framework case.
What we know:
- The CM5, including its mating connectors, is 4.94mm thick.
- There are two connectors for the compute modules (1.5mm and 4.0mm [mated])
- The thickest part of the Framework mainboard is approx. 6.8mm.
- A PCB typically measures 1.57mm in thickness.
- We have to leave approx. 1.1mm clearance below the mainboard, as the standoffs dictate where the PCB can start.
- We probably would have to rely on the case as a heatsink / no active cooling.
Based on these dimensions:
4.94mm (CM5 + connectors) + 1.57mm (carrier board) = 6.51mm, which is less than the 6.8mm limit of the Framework mainboard.
While this seems promising in theory, the carrier board would need to sit on top of the motherboard standoffs. This would result in a significant offset.
Option A
Instead of connecting the CM5 directly to carrier board, we connect it facing down to another PCB (let’s call it bridge) which then is connected to the carrier board.
For that, we’d need to reduce the PCB thickness to 0.8mm.
Would look like this:
And with measurements like this
Option B
If we reduce the thickness of the carrier board to 0.6mm then we could even stack everything on top.
