Hi.
I have to agree, that the work that the framework team has done, is outstanding. In regard to cooling solution and build quality.
But, it’s been almost half a decade since I’ve seen an quality “rugged” laptop/barebone that can survive different “harsher” environments. Such as heat and particles. And it would be great if an manufacturer like Framework would come up with a solution for said problem.
And of course the easiest solution to said problem is making a laptop that does not need fans.
Other manufacturers seem to think that, all users will ever need is: “bigger numbers” on their benchmarks (which is not always the case… I would prefer my laptop to actually work more than a few years). Which is why I still have my old 2018 Omen 17 (7700hq: 1070 laptop not mobile, which is just full 1070 with power limit lowered). And it’s a great machine, it even played cyberpunk without lag, but it’s really old by now. And even the weakest integrated cpu’s beat the 7700hq.
I live near a beach, and so I live next to an active road and the sea (which translates to heated salt water in the air and lots of dust particles). And ideally I would like to be able to use my next laptop: in bed before sleep (watching movies or playing visual novel type games): on public transportation to-and-from work (I currently spend more than 3 hours, on a work day, on public transportation): in the beach house cafe (to enjoy the outdoors even a little bit, and possibly get some sun).
Now some of you might tell me to get an tablet for those, but… As i have bad blood supply to my ligaments, then that is not an lasting solution. Meaning that, my arms go numb if I hold them up for for than 10 minutes and my hands cramp up when I clamp something with them- or extend an finger out (out of the normal position, for touch controls for example) for an extended period of time.
One thing that manufacturers seem to be dead set on is making the smallest/thinnest/lightest computer possible. While it is a good thing, I personally don’t think that it should be one of the main sales pitches. I mean honestly, I couldn’t care if the laptop is 1/4 of an inch or 1/2 of an inch thick. And same goes for the weight: I don’t care if the laptop weighs half a pound or 3 pounds (still way lighter than my Alienware M17xR4, which is 6kg or 13 pounds). And I don’t need an laptop that I can break on my knee.
While the fact that Framework let’s us change the components in our laptops to reduce e-waste is amazing… It just leaves me with the question of: “Why do we have to change the whole cooling solution, while we maybe only want to change the fan?”. The current solution not only pulls dust into the fan (which is normal and fully acceptable), but also on the motherboard itself, which can cause serious problems for it’s longevity/life expectancy. Now I understand that it’s still a work in progress, and it’s bound to change. So I can’t really fault Framework for that, but i’ld like to read some of their thoughts on that.
Now, as I don’t want for this post to be all criticism and me harping on their product (their so-called baby), then I’ld like to offer up some possible solutions next.
- Use a bigger/thicker chassis: this allows for more room for air to move and possibly apply better cooling solution and/or cooling surface.
- You could use a motherboard with an lower tdp cpu on said bigger/thicker chassis to reduce the cooling required and/or remove the active cooling solution entirely for an passive cooling solution.
- Seal off the active cooling solution part from the rest of the cooling solution, so it wouldn’t push dust into the rest of the system internals.
- Make the fan an separate item. So people could just buy the fan itself to replace their old one.
- Switch from bottom air intake, to side air intake. As the only solution that might take in more dust than bottom intake is top intake, which only leaves side intake. And as most laptops are used on a flat table or on lap or on a blanket, then there is almost always an airflow restriction on the bottom intake active cooling solution.
- Design sealed off “air ways”/“wind tunnels”. As to prevent hot air circulation inside the system.
- Use higher tdp cooling solution (even on lower tdp cpu’s), if you can. There has never been a problem with having too good a cooling solution. This applies to both: fans and possible future ‘Solid State Coolers’. As just enough does not last very long.
Now i know this post is probably too long, with me yammering on, so my apologies for that. But those are my thoughts on that matter. And I am kind of happy that I got to give my two cents on that somewhere, where it might actually be useful.
So, thank you.