Labels for Port Capabilities

[Morpheus636]

@ATi

The problem with that approach is that it would affect the passive cooling some of the expansion cards exercise by using metallic lids to distribute their heat to the chassis.

The metal lids on certain expansion cards are because Framework can’t mold plastic that thin, not because they need cooling. On Framework Laptop 13, the top of the expansion cards are against plastic, not metal, and there are no cooling issues with expansion cards.