No, and paradoxically, using a desk fan increases the CPU temp!
Notice and compare CPU (Tctl/Tdie), CPU Skin Temperature, CPU Package Power, CPU PPT SLOW Limit % and APU STAPM Limit %.
As shown, when running GPU load, the temperatures were well below 80C but STAPM capped power to a solid 28W and the cooling fan ran at max RPM, using a desk fan to cool the bottom surface increased the power between 28W and 33W. When running CPU load, the STAPM didn’t cut power all the way and the fan ran slower despite the CPU temp (Tctl) is much higher. Using a desk fan to cool the skin even makes the Tctl temp increased to 100C, triggering TjMax thermal throttling.
My explanation is the temperature between junction and skin depends on thermal conductivity. The better the thermal conductivity the lower the CPU temp the higher the skin temp. in the Ryzen 7, the iGPU has larger surface area than the CPU, thus at a given cooling system, both thermal conductivity(K) and thickness(d) are constant, for iGPU load, the cross-sectional area(A) is much larger than CPU load. For single-core CPU load, the A is even smaller. That’s probably why High CPU temperatures at low utilization. The fan of the FL13 does not consider Tctl, that’s why the fan slows down on CPU load.
In conclusion, improve the thermal conductivity by repasting/PTM7950/LMing will reduce the CPU temperature, but it might increase the skin temperature, making bypassing the STAPM limit even more necessary. This applies only to FL13, on FL16 the opposite is true as the power is often capped by Tctl due to uneven thermals, in this case, repasting increases CPU power.