According to this article, the modular approach is catching on elsewhere. Not quite as thoroughly customizable (one soldered + one SODIMM slot, for example). But it shows other companies are starting to understand the value of the repairable/ upgradable philosophy.
If they’ve announced a product with it, hopefully Framework’s own Core Ultra 3 mainboard announcement should be soon…
Just a thought. Wouldn’t it have been easier if Schenker had just made a “Core Ultra 7 356H” mainboard that fits in a FW16 case?
I guess it is risky, in case FW were internally developing one already.
This is where the lack of roadmap for FW causes problems. Other companies cannot be sure they are carving out a niche for themselves, or just duplicating FW development work.
Also, its kind of difficult for other companies to build a business case around a component for a FW laptop, mainboard or whatever, without knowning how many FW16 laptops are already out there, to build a TAM,SAM,SOM business case.
Soldered on ram, only 1 nvme slot, no dGPU in a16 inch laptop? Not much competition there.