Thank you, @Alan_Pearce. Great points.
I can imagine the complexity involved.
At the same time, we need to start exploring new ideas in design and prototyping.
After all, conformity is the enemy of innovation. 
Notice: my post was moved from another thread “Changing the CPU of the Framework Mainboards”.
As others have mentioned it is not just the CPU that changes each generation, the chipsets change too. This is primarily why Framework sat down and looked at this issue when creating the first Framework Laptop 13. Hence the ability to change the mainboard and have it swappable with every other component. This likely took millions of $$ to put together initially and continues to cost a significant amount of money in R&D to keep using the same platform.
Another example of this are mainboards for desktop computers. AMD has taken this approach with their AM4 and AM5 socket designs. Committing to using it for X years; though the newest processors will require updated chipsets again so it is back to a similar issue that Framework has built their business on.
The alternative would be to create an “upgradable” socket though the limiting factor is going to be stuck using older communication pathways.
Think if there was a mainboard that used the latest 9XXX AMD chip but still ran on DDR2 memory. Who would buy this vs. the incremental cost of upgrading the motherboard ($150?) to take their processor equivalent to an F1 racecar to an actual track where it could really shine.
Other areas of sustainability are equally as challenging and much more achievable. (Solar, MicroHydro, Wind, Geothermal, Recycling Building materials, etc.)
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I don’t think this would make a reliable connection. Manufacturers would be happy to use a simple piece of metal instead of an expensive high-speed connector if it was possible.
Thank you, @pkunk.
I hope we will find new ways forward.
We probably need to rethink some of the paradigms around how things works.
An important point is that we need to talk more about it to expand our ideas.
For now, implementing a solution like a CPU correction frame (thermalright) instead of a soldered CPU could be an excellent next step.
Framework could consider partnering with a company to develop a prototype mobile socket for a current CPU (AMD might be a “simpler” starting point) using a solution similar to the correction frame (thermalright). With this setup, they could prototype a motherboard for testing. I’d love to help in any way I can.