Hi folks, recently bought a FW 13, made it my first full linux I use arch btw machine and it’s been awesome - it’s not been without issues though and so I thought I’d make this thread since I haven’t yet found any other owner of this spec talk about it.
The Radeon 890M feels FAST playing games like Doom Eternal on high settings at 1440x960 (Half of native display resolution), and though I know the FW 16 is more gaming oriented, gaming is not my primary use-case and I highly value the portability aspect, so I’m happy with some compromises here and there.
I installed 2x48GB of DDR5 5600Mhz CL46 RAM into my system and as I gave playing games a whirl, a few minutes in the performance would get cut nearly in half - “Odd” I thought, as battery power was at its maximum, plugged into a power source, and ventilation was clear.
With me thinking the underside air intake being a potential issue, I bought some small adhesive kickstands that sits between, but not on, the airflow grille and the expansion card ports, standing the unit up by a few cm. My theory was to prevent immediate degradation of performance when in use with improved airflow, angle my keyboard for typing, and raise the display of the laptop by a few cm when used.
Frustratingly, performance still suffered in the exact same way! I had to look into why this was happening.
Worth mentioning I did not know amdgpu_top existed at this point, though this would not have identified my issue.
radeontop would show Clip Rectangle at 100% when it normally sits at ~70% before performance degrades, but nothing else - My GPU can’t still be throttling with all this air!
I ran sensors and immediately found the culprit whilst the issue was happening - my RAM was hitting 80C! This is near the provided ‘critical’ alarm level of 85C!
As I’m writing this post in Firefox with no demanding workload, the RAM sensors sit at 61C - 6 degrees over the provided ‘high’ alarm level of 55C - My RAM is running hot!.. but why?
After doing some more thinking and more digging, I realized 2 things:
- The RAM modules are not directly cooled by the fan which is connected to the CPU/GPU
- My RAM modules are dual-sided, which places chips on both sides of the module to achieve high capacity, but makes it relatively more difficult to dissipate the heat it generates.
This was pretty frustrating to learn - I had assumed my CPU/GPU would have been the elephant in the room for heat generation, and didn’t even consider the RAM - I’ll take it as a learning experience.
So now I am awaiting my delivery of non-conductive thermal pads of varying thicknesses which I’ll be able to cut to size, with the goal being to improve heat dissipation altogether - Downgrading to single-sided RAM for reduced thermals is not desirable for my use-case - especially if I want to experiment with locally hosting AI, so I hope that the combination of both the kickstand and the thermal pads will allow me to realize this machine’s full potential.
Of course, I’ll update here once I’m able to try the thermal pad solution out.




