Just today removed the liquid metal from my Framework 16 (batch ~17) and attempted to install the PTM7958 thermal pad that Framework mailed to me almost a year ago. I used too much force in pressing the green pad down, resulting in some of the thermal pad not adhering to the die:
First question is, is it safe to turn on my Framework 16 now? I’m concerned about my CPU getting too hot.
Second question is, how much performance am I possibly losing by using this thermal pad as it’s installed now verses removing it and starting over with a new thermal pad?
Third question, how much more difficult would it be to remove the currently installed PTM after I tried turning on the laptop and burning it in, verses replacing it before turning the laptop on?
the whole silicone glas looking layer needs to be covered for best result, Any areas that doesn’t have any thermal paste will cause issue of heat build up and you will see higher CPU temps since cooler isn’t being able to forward the heat on missing spots over to cooler.
Do you have the pieces that didn’t adhere? Just take them and stick them roughly on the non covered spots.
The PTM is solid at room temp, but liquifies once heated. If the majority of the die is covered, a single heat cycle will be enough to distribute it over the rest as long as it’s roughly centrally placed.
To give another example, for applying non-PTM paste, a common practice was to do a rice grain sized blob in the center of the die and squish it down by reinstalling the heat sink itself.
I don’t really see any issue with your application, even with the gap left there, it’s probably enough to squish over for full coverage after a heating. If you’ve ever looked at an example of someone removing a heatsink with PTM already, you’ll see most of it ends up along the edges of the die anyway, since the actual amount needed is much less than what’s on the pads.
