Well certainly there is some Problems with either the Cooling System or the “Revolotionary Liquid Metal”
As there was still a Thermaldelta and it didn’t feel quite right, even with my new Mainboard.
I decided to remove the Heatsink and take a look. The Heatsink looks, ehm funny, it has hexagonal Bumbs. I Suspect them to be the Reason of the High Tempdelta on the FW16. As those Bumbs has to be filled by Thermal Interface Material. Possibly those are there to help with the surface Tension to keep the LM in Place.
Yes i know, the LM Pad is still not orderable. I Decided to remove all the PTM LM and install PTM 7950. Well, The Thermaldelta got reduced and i got even more CB R23 Points after the initial Burnin. And then today i removed the Heatpipe again and took a look how the PTM 7950 was spread.
Same but more Uniform.
I have decided to “Lap” the Hexagonal Surface to reduce the Bumps and reapply PTM 7950. Now if i ever want to get Liquid Metal under there again i have to get a new Heatsink, as it was coated Copper. And bare Copper without Coating hates Liquid Metal.BUT now i get nearly 15900 Points in CB R23 and the Thermals are more even across all Cores. With the Original Assembly it was 15400.
Edit:
Well i did a new Run right now and i got even more Points, So the PTM 7950 is still in its Burnin Cycle. The CPU Power goes up to 61w and reduces to 51W during an Single Run.
